In the semiconductor SWIR inspection equipment, SWIR semiconductor camera can be used to inspect the quality of pure semiconductor material (usually silicon) after ingot growth. Furthermore, ingots that are subsequently sliced into wafers and these wafers can in a similar way be inspected for defects or cracks.
As the wafers are processed with successive layers to make transistors and memory cells used in modern integrated circuits, SWIR semiconductor high speed ingaas camera is used to check alignment of the layers. High resolution scans of complete wafers are often accomplished with line scan cameras at the wafer defect SWIR inspection stage.
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